Bond systems FOR Diamond Grinding wheel (resin bond)
Bond systems FOR Diamond Grinding wheel
Resin bonded diamond grinding wheel
1.Structure of the diamond layer:
•Diamond.
•Resin bond.
•Filler.
2.Characteristics:
Insignificant bond hardness.
•High removal productivity.
•Reduced work time.
•Low thermal conductivity and
thermal stability.
3.Resin-bond diamond wheels are used for fine and finishing operations, the fine sharpening and finishing of tungsten carbide cutting tools and superabrasive materials, and fine grinding and finishing of measuring and medical tools and workpieces of hard materials
Resin bonded diamond grinding wheel
1.Structure of the diamond layer:
•Diamond.
•Resin bond.
•Filler.
2.Characteristics:
Insignificant bond hardness.
•High removal productivity.
•Reduced work time.
•Low thermal conductivity and
thermal stability.
3.Resin-bond diamond wheels are used for fine and finishing operations, the fine sharpening and finishing of tungsten carbide cutting tools and superabrasive materials, and fine grinding and finishing of measuring and medical tools and workpieces of hard materials
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| Resin bonded diamond tools |
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